Dae-Gon Kim: шукати на сайті Z-Library

Microelectronics Reliability

Рік:

2005

Мова:

english

Файл:

PDF, 388 KB

english, 2005

Effect of high-speed loading conditions on the fracture mode of the BGA solder joint

Jong-Woong Kim, Jin-Kyu Jang, Sang-Ok Ha, Sang-Su Ha, Dae-Gon Kim, Seung-Boo Jung

Журнал:

Рік:

2008

Мова:

english

Файл:

PDF, 905 KB

english, 2008

[Int. Acad. Publishers ICEMS 2001. Proceedings of the Fifth International Conference on Electrical Machines and Systems - Shenyang, China (18-20 Aug. 2001)] ICEMS'2001. Proceedings of the Fifth International Conference on Electrical Machines and Systems (IEEE Cat. No.01EX501) - Speed control of AC servo motor using neural networks

Pyoung-Ho Kim,, Sa-Hyun Sin,, Hyung-Lae Baek,, Geum-Bae Cho,, Dae-Gon Kim,, Dong-Hui Kim,

Рік:

2001

Мова:

english

Файл:

PDF, 271 KB

english, 2001

Evaluation of displacement rate effect in shear test of Sn–3Ag–0.5Cu solder bump for flip chip application

Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung

Журнал:

Microelectronics Reliability

Рік:

2006

Мова:

english

Файл:

PDF, 717 KB

english, 2006

Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method

Sang-Su Ha, Dae-Gon Kim, Jong-Woong Kim, Jeong-Won Yoon, Jin-Ho Joo, Young-Eui Shin, Seung-Boo Jung

Журнал:

Surface and Interface Analysis

Рік:

2007

Мова:

english

Файл:

PDF, 961 KB

english, 2007

Characteristic analysis of electroless Ni plating layer for electronic packaging

Dae-Gon Kim, Jong-Woong Kim, Jeong-Won Yoon, Won-Bae Lee, Seung-Boo Jung

Журнал:

Рік:

2006

Мова:

english

Файл:

PDF, 190 KB

english, 2006

Mechanical strength test method for solder ball joint in BGA package

Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung

Журнал:

Metals and Materials International

Рік:

2005

Мова:

english

Файл:

PDF, 1.11 MB

english, 2005

Solid state intermetallic compound layer growth between Sn-8Zn-3Bi solder and bare copper substrate

Dae-Gon Kim, Hyung-Sun Jang, Seung-Boo Jung

Журнал:

Journal of Materials Science: Materials in Electronics

Рік:

2005

Мова:

english

Файл:

PDF, 857 KB

english, 2005

Correlation between the interfacial reaction and mechanical joint strength of the flip chip solder bump during isothermal aging

Dae-Gon Kim, Hyung-Sun Jang, Jong-Woong Kim, Seung-Boo Jung

Журнал:

Journal of Materials Science: Materials in Electronics

Рік:

2005

Мова:

english

Файл:

PDF, 1.15 MB

english, 2005

Evaluation of solder joint reliability in flip-chip packages during accelerated testing

Jong-Woong Kim, Dae-Gon Kim, Won Sik Hong, Seung-Boo Jung

Журнал:

Journal of Electronic Materials

Рік:

2005

Мова:

english

Файл:

PDF, 901 KB

english, 2005

Solder joint reliability in flip chip package with surface treatment of ENIG under thermal shock test

Sang-Su Ha, Sang-Ok Ha, Jeong-Won Yoon, Jong-Woong Kim, Min-Kwan Ko, Dae-Gon Kim, Sung-Jin Kim, Tae-Hwan Hong, Seung-Boo Jung

Журнал:

Metals and Materials International

Рік:

2009

Мова:

english

Файл:

PDF, 1.59 MB

english, 2009

Evaluation of solder joint reliability in flip chip package under thermal shock test

Dae-Gon Kim, Jong-Woong Kim, Seung-Boo Jung

Журнал:

Thin Solid Films

Рік:

2006

Мова:

english

Файл:

PDF, 696 KB

english, 2006

Interfacial reactions and intermetallic compound growth between indium and copper

Dae-Gon Kim, Chang-Youl Lee, Seung-Boo Jung

Журнал:

Journal of Materials Science: Materials in Electronics

Рік:

2004

Мова:

english

Файл:

PDF, 145 KB

english, 2004

Interfacial reactions and growth kinetics for intermetallic compound layer between In–48Sn solder and bare Cu substrate

Dae-Gon Kim, Seung-Boo Jung

Журнал:

Journal of Materials Chemistry C

Рік:

2005

Мова:

english

Файл:

PDF, 456 KB

english, 2005

A thin all-elastomeric capacitive pressure sensor array based on micro-contact printed elastic conductors

Woo, Su-Jeong, Kong, Jeong-Ho, Kim, Dae-Gon, Kim, Jong-Man

Журнал:

Рік:

2014

Мова:

english

Файл:

PDF, 1.33 MB

english, 2014

Force and torque characteristics for a slotless Lorentz self-bearing servomotor

Stephens, L.S., Dae-Gon Kim,

Журнал:

IEEE Transactions on Magnetics

Рік:

2002

Мова:

english

Файл:

PDF, 420 KB

english, 2002

Analysis of Failure Mechanism in Anisotropic Conductive and Non-Conductive Film Interconnections

Jong-Woong Kim,, Dae-Gon Kim,, Young-Chul Lee,, Seung-Boo Jung,

Журнал:

IEEE Transactions on Components and Packaging Technologies

Рік:

2008

Мова:

english

Файл:

PDF, 4.20 MB

english, 2008

[IEEE 2019 International Conference on Optical MEMS and Nanophotonics (OMN) - Daejeon, Korea (South) (2019.7.28-2019.8.1)] 2019 International Conference on Optical MEMS and Nanophotonics (OMN) - Brillouin Lasers Based On 11 Million-Q On-Chip Chalcogenide Resonators Without Direct Etch Process

Han, Sangyoon, Kim, Dae-Gon, Hwang, Joonhyuk, Do, In Hwan, Jeong, Dongin, Dee, Yong-Hee, Choi-, Duk-Yong, Lee, Hansuek

Рік:

2019

Мова:

english

Файл:

PDF, 1.35 MB

english, 2019

MEMS-based in-situ tensile experiments designed to arrest catastrophic failure in brittle nanomaterials

Ahn, Daehyeok, Kim, Dae-Gon, Lee, Hansuek, Jang, Dongchan

Журнал:

Extreme Mechanics Letters

Рік:

2020

Файл:

PDF, 1.22 MB

2020

Thermal degradation of anisotropic conductive film joints under temperature fluctuation

Jong-Woong Kim, Ja-Myeong Koo, Chang-Yong Lee, Bo-In Noh, Jeong-Won Yoon, Dae-Gon Kim, Sun-Kyu Park, Seung-Boo Jung

Журнал:

International Journal of Adhesion and Adhesives

Рік:

2008

Мова:

english

Файл:

PDF, 1000 KB

english, 2008

Reliability of adhesive interconnections for application in display module

Jong-Woong Kim, Young-Chul Lee, Dae-Gon Kim, Seung-Boo Jung

Журнал:

Dae-Gon Kim, Jong-Woong Kim, Seung-Boo Jung

Рік:

2007

Мова:

english

Файл:

PDF, 489 KB

english, 2007

Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn–3.0Ag–0.5Cu solder and Ni–P UBM

Журнал:

Materials Science and Engineering: B

Рік:

2005

Мова:

english

Файл:

PDF, 549 KB

english, 2005

Photolysis of ethyl chloride at 121.6 nm

Sung-Seen Choi, Dae-Gon Oh, Seong Keun Kim, Kyung-Hoon Jung

Журнал:

Journal of Photochemistry and Photobiology A: Chemistry

Рік:

1992

Мова:

english

Файл:

PDF, 768 KB

english, 1992

Effects of electromigration on microstructural evolution of eutectic SnPb flip chip solder bumps

Dae-Gon Kim, Won-Chul Moon, Seung-Boo Jung

Журнал:

Materials Science and Engineering: A

Рік:

2006

Мова:

english

Файл:

PDF, 1.18 MB

english, 2006

Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages

Ja-Myeong Koo, Yu-Na Kim, Jeong-Won Yoon, Dae-Gon Kim, Bo-In Noh, Jong-Woong Kim, Jung-Hoon Moon, Seung-Boo Jung

Журнал:

Рік:

2008

Мова:

english

Файл:

PDF, 660 KB

english, 2008

Effects of design parameters on the noise of rotor-bearing systems

Byoung-Hoo Rho, Dae-Gon Kim, Kyung-Woong Kim

Журнал:

Tribology International

Рік:

2004

Мова:

english

Файл:

PDF, 180 KB

english, 2004

Investigations of the test parameters and bump structures in the shear test of flip chip solder bump

Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung

Журнал:

Thin Solid Films

Рік:

2006

Мова:

english

Файл:

PDF, 323 KB

english, 2006

Analysis and simulation of a Lorentz-type slotless, self-bearing motor

Lyndon S. Stephens, Dae-Gon Kim

Журнал:

Control Engineering Practice

Рік:

2002

Мова:

english

Файл:

PDF, 262 KB

english, 2002

The effect of isothermal aging on the thickness of intermetallic compound layer growth between low melting point solders and Ni-plated Cu substrate

Dae-Gon Kim, Seung-Boo Jung

Журнал:

Journal of Electronic Materials

Рік:

2004

Мова:

english

Файл:

PDF, 669 KB

english, 2004

Reliability investigation and interfacial reaction of ball-grid-array packages using the lead-free Sn-Cu solder

Jeong-Won Yoon, Sang-Won Kim, Ja-Myeong Koo, Dae-Gon Kim, Seung-Boo Jung

Журнал:

Journal of Electronic Materials

Рік:

2004

Мова:

english

Файл:

PDF, 1.29 MB

english, 2004

Alterations to the mechanical response of the gastrointestinal tract induced by functional gastrointestinal disorders and the feasibility of developing an ultrasonic diagnostic system

Dohyung Lim, Dae-Gon Woo, Won-Pil Park, Han-Sung Kim, In-Deok Kong, Yong-Heum Lee

Журнал:

Journal of Mechanical Science and Technology

Рік:

2008

Мова:

english

Файл:

PDF, 355 KB

english, 2008

Bone response of Mg ion-implanted clinical implants with the plasma source ion implantation method

Lee-Ra Cho, Dae-Gon Kim, Jong-Hwa Kim, Eung-Sun Byon, Yong-Soo Jeong, Chan-Jin Park

Журнал:

Clinical Oral Implants Research

Рік:

2010

Мова:

english

Файл:

PDF, 1.58 MB

english, 2010

Gene expression in Ca or Mg implanted titanium surfaces

Ko, Kyung-Ho, Kim, Dae-Gon, Lee, HeeSu, Byon, EungSun, Jeong, YongSoo, Park, Chan-Jin, Cho, Lee-Ra

Журнал:

Tissue Engineering and Regenerative Medicine

Рік:

2012

Мова:

english

Файл:

PDF, 724 KB

english, 2012

Piezoresistive Strain Sensors and Multiplexed Arrays Using Assemblies of Single-Crystalline Silicon Nanoribbons on Plastic Substrates

Sang Min Won, Hoon-Sik Kim, Nanshu Lu, Dae-Gon Kim, Del Solar, C., Duenas, T., Ameen, A., Rogers, J.A.

Журнал:

IEEE Transactions on Electron Devices

Рік:

2011

Мова:

english

Файл:

PDF, 504 KB

english, 2011

Intermetallic compound layer growth at the interface between Sn–Cu–Ni solder and Cu substrate

Jeong-Won Yoon, Young-Ho Lee, Dae-Gon Kim, Han-Byul Kang, Su-Jeong Suh, Cheol-Woong Yang, Chang-Bae Lee, Jong-Man Jung, Choong-Sik Yoo, Seung-Boo Jung

Журнал:

Рік:

2004

Мова:

english

Файл:

PDF, 439 KB

english, 2004

Solid state interfacial reaction and joint strength of Sn–37Pb solder with Ni–P under bump metallization in flip chip application

Dae-Gon Kim, Jong-Woong Kim, Jung-Goo Lee, Hirotaro Mori, David J. Quesnel, Seung-Boo Jung

Журнал:

Рік:

2005

Мова:

english

Файл:

PDF, 666 KB

english, 2005

Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints

Dae-Gon Kim, Jong-Woong Kim, Sang-Su Ha, Bo-In Noh, Ja-Myeong Koo, Dong-Woon Park, Myung-Wan Ko, Seung-Boo Jung

Журнал:

Clinical Oral Implants Research

Рік:

2008

Мова:

english

Файл:

PDF, 2.84 MB

english, 2008

High-Performance, Transparent, and Stretchable Electrodes Using Graphene–Metal Nanowire Hybrid Structures

Lee, Mi-Sun, Lee, Kyongsoo, Kim, So-Yun, Lee, Heejoo, Park, Jihun, Choi, Kwang-Hyuk, Kim, Han-Ki, Kim, Dae-Gon, Lee, Dae-Young, Nam, SungWoo, Park, Jang-Ung

Журнал:

Nano Letters

Рік:

2013

Мова:

english

Файл:

PDF, 1.06 MB

english, 2013

[IEEE 2007 International Symposium on Information Technology Convergence (ISITC 2007) - Jeonju, Korea (2007.11.23-2007.11.24)] 2007 International Symposium on Information Technology Convergence (ISITC 2007) - Improved Fast Mode Decision Algorithm for Variable Macro Block Motion Compensation in H.264

Kim, Dae-gon, Yoo, Cheol-jung, Chang, Ok-bae, Kim, Eun-mi, Choi, Jong-Ryeol

Рік:

2007

Мова:

english

Файл:

PDF, 509 KB

english, 2007

Axial displacements in external and internal implant-abutment connection

Lee, Ji-Hye, Kim, Dae-Gon, Park, Chan-Jin, Cho, Lee-Ra

Журнал:

Рік:

2014

Мова:

english

Файл:

PDF, 422 KB

english, 2014

A Noise Analysis of Cylindrical Roller Bearings Operating Under Zero External Load

Rho, Byoung-Hoo, Kim, Dae-Gon, Kim, Kyung-Woong

Журнал:

Tribology Transactions

Рік:

2005

Мова:

english

Файл:

PDF, 606 KB

english, 2005

Electrically and mechanically enhanced Ag nanowires-colorless polyimide composite electrode for flexible capacitive sensor

Kim, Dae-Gon, Kim, Jiwan, Jung, Seung-Boo, Kim, Young-Sung, Kim, Jong-Woong

Журнал:

Applied Surface Science

Рік:

2016

Мова:

english

Файл:

PDF, 2.15 MB

english, 2016

Simple method for high-performance stretchable composite conductors with entrapped air bubbles

Hwang, Hyejin, Kim, Dae-Gon, Jang, Nam-Su, Kong, Jeong-Ho, Kim, Jong-Man

Журнал:

Nanoscale Research Letters

Рік:

2016

Мова:

english

Файл:

PDF, 2.25 MB

english, 2016

[IEEE 2016 International Conference on Optical MEMS and Nanophotonics (OMN) - Singapore, Singapore (2016.7.31-2016.8.4)] 2016 International Conference on Optical MEMS and Nanophotonics (OMN) - Square-shaped glass microlens array for fiber-optic neurostimulation

Sunghyun Yoo,, Dae-Gon Kim,, Hongkyun Lee,, Sang Beom Jun,, Yong-Kweon Kim,, Chang-Hyeon Ji,

Рік:

2016

Мова:

english

Файл:

PDF, 1.54 MB

english, 2016

Characterization of Failure Behaviors in Anisotropic Conductive Interconnection

Kim, Jong-Woong, Kim, Dae-Gon, Koo, Ja-Myeong, Yoon, Jeong-Won, Choi, Sunglak, Kim, Kyung-Sik, Nam, Jae-Do, Lee, Hoo-Jeong, Joo, Jinho, Jung, Seung-Boo

Журнал:

Kim, Dae-Gon, Jung, Seung-Boo

Рік:

2007

Мова:

english

Файл:

PDF, 494 KB

english, 2007

Microstructure and Mechanical Properties of Sn–0.7Cu Flip Chip Solder Bumps Using Stencil Printing Method

Журнал:

Kim, Dae-Gon, Yoon, Jeong-Won, Lee, Chang-Youl, Jung, Seung-Boo

Рік:

2005

Мова:

english

Файл:

PDF, 250 KB

english, 2005

Reaction Diffusion and Formation of Cu11In9 and In27Ni10 Phases in the Couple of Indium-Substrates

Журнал:

Kim, Dae-Gon, Jung, Seung-Boo

Рік:

2003

Мова:

english

Файл:

PDF, 507 KB

english, 2003

Intermetallic Compound Formation and Growth Kinetics in Flip Chip Joints Using Sn–3.0Ag–0.5Cu Solder and Ni–P under Bump Metallurgy

Журнал: